Increased thermal performance as the distance between LED chips increases

GaoweiXu et al. studied the small heat-dissipating fins on supercomputers. The results show that the thickness and spacing of the fins affect the heat dissipation performance of the fins. For small heat-dissipating fins, the optimal fin spacing is 0.5mm~2mm, optimal wing The sheet thickness is from 0.1mm to 1mm, which can be used as an empirical parameter for designing small heat dissipating fins. Through experiments, it is found that as the distance between LED chips increases, the heat dissipation performance will increase, but after reaching a certain level, the change will be slow. Ma, HK and so on use the honeycomb structure combined with the chimney effect to design a honeycomb heat sink with a weight of only 75-125g, which can dissipate heat through natural convection and hardly affect the heat dissipation performance. In short, the design of the heat dissipating fins requires consideration of the overall structure, shape, thickness, height, width, inter-chip gap and other parameters of the fin according to the specific heat dissipation requirements of the LEDs of different powers.

Thermoelectric refrigeration thermoelectric refrigeration technology uses the Peltier effect of semiconductors for refrigeration. When direct current is passed through a series of galvanic couples of different semiconductor materials, heat can be absorbed and heat can be released at both ends of the galvanic couple to achieve refrigeration. Thermoelectric refrigeration system (TEC) is sensitive, generally reaches the maximum temperature difference in 1min. It is controlled by closed-loop temperature control circuit with accuracy of ±0.1°C, small body, light weight and no noise. Invented a life-saving heat dissipation method such as an array LED, which uses a semiconductor refrigeration chip to separately cool each LED, and each particle in one LED array can achieve an equal life operation. Tian Dalei and other inputs of 0.3A ~ 0.7A current to the thermoelectric system, the cooling rate reached 36.4% ~ 45.1%, the cooling effect is very obvious. Although the cold-end refrigeration effect of the thermoelectric refrigeration system is very good, the heat dissipation problem at the hot end has a great influence on the thermal performance of the entire thermal power Guo Lingwei, etc.: LED heat dissipation technology and its research progress system. Therefore, heat fins are generally added at the hot end. The combination can greatly increase the heat dissipation effect. An optimized heat dissipating fin is designed for the thermoelectric refrigeration system, which reduces the thermal resistance by 9%, and the heat absorption rate to the hot end is increased by about 27% compared with the general heat dissipating fin. In general, the heat source needs to cover only about 18% of the area of ​​the semiconductor refrigerating sheet, and a better cooling effect can be achieved. Using the geneticgorithm (GA) method, the length of the optimal semiconductor unit can be calculated according to the thermal resistance of the hot end. The area and quantity to get the maximum cooling effect.

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